E Systems Technology
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Capabilities

 

SOURCE-BUILD-INTEGRATE-SUPPORT


LEVEL 1: Components - Wire Processing

  •     Cut to length (+/-0.5%)

  •     Strip (with or without slugs)

  •     Terminated

  •     Solder/Tin dipped

  •     Labeled

  •     Bundled




LEVEL 1: Components - Insert Molding/Encapsulating

  •    Strain Relief

  •    Grommets

  •    Standard/Custom Connectors

  •    Mounting Brackets

  •    RTD's, Thermistors, Sensors




LEVEL 2: Subassemblies - Wire Harnesses

  •    Marine, RV, Automotive and Appliance

  •    AMP/Tyco, Molex, Deutsch, Delphi/Packard & more

  •    Wide range of tooling available

  •    Custom connectors




LEVEL 3: Assemblies

  •    Laser/Optics Assemblies

  •    Stage Assemblies

  •    Electronic Assemblies

  •    Kitting/Packaging

  •    Prototyping, Service and Testing

  •  



LEVEL 4: Modules

  •    Electronics Packages

  •    Controls Modules

  •    Robots/Controllers

  •    Power Distribution Units




LEVEL 5: Systems

  •    Medical Robotic Systems

  •    Wafer Automation Systems

  •    Consumer Robotics Products

  •    Power Distribution Systems